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	› BiTS ( Burn-in & Test Socket ) › Connector BU › Semiconductor BU › Precision Technology BU › Display BU

Next Generation Flash Memory Burn-in Socket Solution Stacked Package Solution Available Socket Part No: B2052B-A1B33 Device : Flash memory Applicable PKG : 52pin ULGA Package Thickness : 0.71/1.00/1.47mm etc Socket Outline : 25x26mm Socket Height (in free position) : 17.0±0.2mm Socket Height (full stroke) : 14.00±0.3mm Applicable Pad Pitch : 0.5, 0.65, 0.8, 0.4mm Applicable Max. PKG Size : 14x18mm Applicable Min. PKG Size : 4x4mm Applicable Max. Pad Matrix : 23x31 (0.5mm Pitch) Lid Actuation Force : Max 3kg Contact Force : 15±2gm Contact Resistance : 50mΩ Max Current Capacity : 0.6A