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The CE-2900 ® is a testing system for micro pitch and high density of semiconductor package substrates, using step & repeat mechanism with Non-Contact Sensor technology. The pad non-contact technology successfully removes any pad damage by Pin Attack. Featuring fixtureless technology, the system enables to eliminate repeating fixed cost and time for making new fixture for substrate change, when users only control Recipe in system manual. Besides, the technology can remove misalignment or mismatch between contactors and substrate pads. For more information on this, please contact to us. Equipment type: PCB test system Target products: fine pitch IC substrate (BGA, CSP, etc) Operation: manual, semi-auto, full automated Operating system: Window XP Major features: - Minimum pad pitch: 40um and above - Fixtureless - Pad non-contact - Testing Net circuit - Possible to test Isolation Via - Manual & automated operation Major test items: open, short, leakage Difficult to test fine pitch pad testing Requires high cost for fixture fabrication Higher potential test failures by mis-alignment due to tolerance of system, product and fixture   Fine pitch pad testing No additional cost thanks to fixtureless method No PCB Pad Attack by contactless method Better testing yield by higher accuracy