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 A heat spreader is designed and used for the improvement of heat distribution that generates during device operation.
OKins has developed and produced a unique solution for memory module heat spreader for cost effectiveness and stable quality control under high volume production.
The stamping technology for the product is outstanding in the market, and the automated Thermal Interface Material spreading solution has realized stable lead time as well.
Our engineering efforts outreaches to the development of more stable heat distribution performance through a new material study and quality improvement through thorough process control. |
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